Space has been called “the final frontier” in both fiction and reality, and it does represent a challenging market for many companies which build EEE components for Space missions. Components built for use on board of satellites simply cannot fail during the intended lifetime of the satellite.
Along with high reliability, there is also the expectation that performance remains at the highest levels, with minimal degradation, for lifetime of mission. For this reason testing activity is an essential step in preparing EEE components for applications in Space.
DPA is a detailed examination of EEE components at various stages of physical disassembly. This test verifies that the component quality is in accordance with the detailed project requirements.
FA is the process of analysing the component to find out the reason for degradation or failure of a EEE component, during component manufacturing and testing, during incoming inspection or after delivery to the client.
Die Shear test has the target to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates.